Kwang Lung Lin,: search on Z-Library

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1

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu-Wei Lin, Ren-You Wang, Wun-Bin Ke, I-Sheng Wang, Ying-Ta Chiu, Kuo-Chang Lu, Kwang-Lung Lin, Yi-Shao Lai

Journal:

Materials Science and Engineering: A

Year:

2012

Language:

english

File:

PDF, 1.49 MB

english, 2012

2

Low-Power Gate Driver Circuit for TFT-LCD Application

Chih-Lung Lin, Chun-Da Tu, Chia-En Wu, Chia-Che Hung, Kwang-Jow Gan, Kuan-Wen Chou

Journal:

IEEE Transactions on Electron Devices

Year:

2012

Language:

english

File:

PDF, 981 KB

english, 2012

3

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, Jr-Wei, Chen, Yan-Siang, Chen, Yi, Liang, Jiang-Long, Lin, Kwang-Lung, Lee, Yuh-Lang

Year:

2014

Language:

english

File:

PDF, 2.86 MB

english, 2014

4

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

Liu, De‐Shin, Hsu, Chang‐Lin, Kuo, Chia‐Yuan, Huang, Ya‐Ling, Lin, Kwang‐Lung, Shen, Geng‐Shin

Journal:

Soldering & Surface Mount Technology

Year:

2012

Language:

english

File:

PDF, 450 KB

english, 2012

5

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, Jagjiwan, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 1.54 MB

english, 2018

6

Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

Kwang-Lung Lin,, Yi-Cheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 3.09 MB

english, 1999

7

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Yu-Wei, Su, Mei-Chen, Huang, Wei-Hsiang, Chiu, Ying-Ta, Shih, Te-Ping, Lin, Kwang-Lung

Year:

2016

File:

PDF, 666 KB

2016

8

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Ying-Ta, Chiang, Tzu-Hsing, Chen, Yin-Fa, Yang, Ping-Feng, Huang, Louie, Lin, Kwang-Lung

Year:

2014

Language:

english

File:

PDF, 3.22 MB

english, 2014

9

Material interactions of solder bumps produced with fluxless wave soldering

Kwang-Lung Lin, Wen-Hsiuan Chao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1998

Language:

english

File:

PDF, 165 KB

english, 1998

10

Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy

Kwang-Lung Lin,, Ya-Te Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 907 KB

english, 1999

11

Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

Mittal, Jagjiwan, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 2.74 MB

english, 2017

12

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Ying-Ta, Chiang, Tzu-Hsing, Yang, Ping-Feng, Huang, Louie, Hung, Chih-Pin, Uegaki, Shoji, Lin, Kwang-Lung

Year:

2016

Language:

english

File:

PDF, 1.19 MB

english, 2016

13

Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps

Kwang-Lung Lin,, Yi-Cheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.03 MB

english, 1999

14

Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder

Kwang-Lung Lin,, Jia-Wei Hwang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2002

Language:

english

File:

PDF, 745 KB

english, 2002

15

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, Wei-Hsiang, Lin, Kwang-Lung, Lin, Yu-Wei, Cheng, Yun-Kai

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 4.15 MB

english, 2016

16

Materials interaction in PbSn/NiP/Al and PbSn/NiB/Al solder bumps on chips

Chwan-Ying Lee, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

1993

Language:

english

File:

PDF, 1.91 MB

english, 1993

17

Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent

Frischa, M. W., Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.77 MB

english, 2016

18

The performance and fracture mechanism of solder joints under mechanical reliability test

Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.84 MB

english, 2012

19

Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution

Udit Surya Mohanty, Kwang-Lung Lin

Journal:

Corrosion Science

Year:

2008

Language:

english

File:

PDF, 2.19 MB

english, 2008

20

Wave soldering bumping process incorporating electroless nickel UBM

Kwang-Lung Lin,, Jun-Wen Chen,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 1.25 MB

english, 2000

21

Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics

CHWAN-YING LEE, KWANG-LUNG LIN

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1997

Language:

english

File:

PDF, 1.26 MB

english, 1997

22

The interactions among the AlMo-NAu multilayer

Kwang-lung Lin, Yu-Jin Ho

Journal:

Thin Solid Films

Year:

1995

Language:

english

File:

PDF, 492 KB

english, 1995

23

Adhesion of multilayer solder pads on silicon

KWANG-LUNG LIN, SHIN-KUO CHEN, SHIUH-YUAN CHANG

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1997

Language:

english

File:

PDF, 1.62 MB

english, 1997

24

Effects of current density and deposition time on electrical resistivity of electroplated Cu layers

Chien-Tai Lin, Kwang-Lung Lin

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2004

Language:

english

File:

PDF, 635 KB

english, 2004

25

Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

Materials Chemistry and Physics

Year:

2020

File:

PDF, 7.87 MB

2020

26

Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder

Liu, Chin-Wei, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 2.98 MB

english, 2014

27

The interaction kinetics and compound formation between electroless NiP and solder

Chwan-Ying Lee, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

1994

Language:

english

File:

PDF, 1.10 MB

english, 1994

28

Alternating sputtered Al-Mo deposits and their interaction with a Au top layer

Kwang-Lung Lin, Yu-Jin Ho, Jin-Kuo Ho

Journal:

Thin Solid Films

Year:

1995

Language:

english

File:

PDF, 780 KB

english, 1995

29

Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Liang, Chien-Lung, Lin, Kwang-Lung, Peng, Jr-Wei

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.12 MB

english, 2016

30

Effect of Al on the electrochemical corrosion behaviour of Pb free Sn–8.5 Zn–0.5 Ag–XAl–0.5 Ga solder in 3.5% NaCl solution

Udit Surya Mohanty, Kwang-Lung Lin

Journal:

Applied Surface Science

Year:

2006

Language:

english

File:

PDF, 569 KB

english, 2006

31

Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates

Yu-Hsiang Hsiao, Kwang-Lung Lin, Chiu-Wen Lee, Yu-Hsiu Shao, Yi-Shao Lai

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.64 MB

english, 2012

32

The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process

Kwang-Lung Lin, Yu-Wei Lin, Chang-Ho Yu

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2012

Language:

english

File:

PDF, 662 KB

english, 2012

33

A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder

Kwang-Lung Lin, Kang-I Chen, Po-Cheng Shi

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 181 KB

english, 2003

34

IMC formation on BGA package with Sn–Ag–Cu and Sn–Ag–Cu–Ni–Ge solder balls

Kwang-Lung Lin, Po-Cheng Shih

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 2.53 MB

english, 2008

35

Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun-Jen Chen,, Kwang-Lung Lin,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1997

Language:

english

File:

PDF, 133 KB

english, 1997

36

Manufacturing and materials properties of Ti/Cu/Electroless Ni/solder bump on Si

Kun-Tzu Hsu,, Kwang-Lung Lin,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 120 KB

english, 2000

37

Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate

Wei-Luen Jang, Tsung-Chieh Chiu, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1.01 MB

english, 2011

38

Solder thickness variation with respect to soldering parameters

Yao, S., Kwang-Lung Lin,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 63 KB

english, 2000

39

Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate

Niu, Xi, Lin, Kwang-Lung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 1.95 MB

english, 2017

40

The wetting of copper by Al–Zn–Sn solders

Kwang-Lung Lin, Li-Hsiang Wen

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1998

File:

PDF, 7.34 MB

1998

41

The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Lin, Yu-Wei, Ke, Wun-Bin, Wang, Ren-You, Wang, I-Sheng, Chiu, Ying-Ta, Lu, Kuo-Chang, Lin, Kwang-Lung, Lai, Yi-Shao

Journal:

Surface and Coatings Technology

Year:

2013

Language:

english

File:

PDF, 940 KB

english, 2013

42

Investigations of the wetting behaviors of Zn–25Sn, Zn–25Sn–XPr and Zn–25Sn–YAl high temperature lead free solders in air and Ar ambient

Niu, Xi, Lin, Kwang-Lung

Journal:

Journal of Alloys and Compounds

Year:

2015

Language:

english

File:

PDF, 2.13 MB

english, 2015

43

Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Huang, Wei-Chih, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.70 MB

english, 2016

44

Electromigration Reliability of Advanced High-density Fan-out Packaging with Fine-pitch 2lm/2lm L/S Cu Redistribution Line

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.61 MB

2020

45

Treatment of uranium containing effluents with reverse osmosis process

Kwang-Lung Lin, Min-Lin Chu, Mu-Chang Shieh

Journal:

Year:

1987

Language:

english

File:

PDF, 671 KB

english, 1987

46

NiCuP and NiCoP as a diffusion barrier between an Al pad and a solder bump

Chwan-Ying Lee, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

1994

Language:

english

File:

PDF, 945 KB

english, 1994

47

Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer

Kwang-Lung Lin,, Shiuh-Yuan Chang,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1996

Language:

english

File:

PDF, 822 KB

english, 1996

48

Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps

Chun-Jen Chen,, Kwang-Lung Lin,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 233 KB

english, 2001

49

The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

Hsiao, Yu-Hsiang, Lin, Kwang-Lung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 1.66 MB

english, 2016

50

The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing

Wang, Ting-Hui, Lin, Kwang-Lung

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.82 MB

english, 2016

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